Microstructural characteristics influencing the effective thermal conductivity of particulate thermal interface materials

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 227-237

  Kanuparthi, S ^a   Subbarayan, G ^a   Sammakia, B ^b   Siegmund, T ^a  

^a PURDUE UNIVERSITY   (United States)

^b BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; CARBON FIBER REINFORCED PLASTICS; CODES (SYMBOLS); COMPUTER NETWORKS; COMPUTER PROGRAMMING; DISTRIBUTION FUNCTIONS; ELECTRONIC EQUIPMENT; ELECTRONICS ENGINEERING; ELECTRONICS INDUSTRY; FIGHTER AIRCRAFT; FILLERS; FORMING; IMAGE SEGMENTATION; JAVA PROGRAMMING LANGUAGE; MATRIX ALGEBRA; MICROSTRUCTURE; PROBABILITY DISTRIBUTIONS; RANDOM PROCESSES; RISK ASSESSMENT; SILICONES; SIZE DISTRIBUTION; THERMAL CONDUCTIVITY; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOMECHANICAL TREATMENT;

EFFECTIVE THERMAL CONDUCTIVITY;

THERMAL INSULATING MATERIALS;

EID: 50949125371     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544275     Document Type: Conference Paper

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