Determination of interfacial properties between AlN and aluminum beneath salt at high temperature

Materials Science and Engineering: A

Volumn 495, Issue 1-2, 2008, Pages 60-64

  Mutale, C T ^a   Weirauch, D A ^a   Cramb, A W ^b  

^a ALCOA TECHNICAL CENTER   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Aluminum; Aluminum nitride; Cryolitic salt; Interfacial energy; Surface tension; Wettability; Work of adhesion; X ray technique

Indexed keywords

ADHESION; ALUMINUM; ALUMINUM NITRIDE; CONDUCTIVE MATERIALS; III-V SEMICONDUCTORS; INTERFACIAL ENERGY; LIQUID METALS; NITRIDES; SCANNING ELECTRON MICROSCOPY; WETTING;

ALUMINUM INDUSTRY; CRYOLITIC SALT; ELECTROLYSIS CELL; HIGHEST TEMPERATURE; INTERFACIAL PROPERTY; LIQUID ALUMINUM; MOLTEN ALUMINIUM; MOLTEN ALUMINUM; WORK OF ADHESION; X-RAY TECHNIQUES;

CHEMICAL STABILITY;

EID: 50949117982     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.10.106     Document Type: Article

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