Influence of oxygen on the joining between copper and aluminium nitride

Journal of the European Ceramic Society

Volumn 27, Issue 1, 2007, Pages 337-341

  Jarrige, J ^a   Joyeux, T ^a   Lecompte, J P ^a   Labbe, J C ^a  

^a CNRS   (France)

Author keywords

AlN; Copper; Cu; Joining; Substrate; Thermal conductivity

Indexed keywords

ALUMINUM NITRIDE; BONDING; COPPER; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; HEAT LOSSES; INTERFACES (MATERIALS); OXIDATION; SURFACE TENSION; THERMAL CONDUCTIVITY;

ELECTRONIC CERAMIC PACKAGING; EUTECTIC PHASE; METAL/CERAMIC INTERFACE; SESSILE DROP METHOD;

CERAMIC MATERIALS;

ALUMINUM NITRIDE; BONDING; CERAMIC MATERIALS; COPPER; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; HEAT LOSSES; INTERFACES (MATERIALS); OXIDATION; SURFACE TENSION; THERMAL CONDUCTIVITY;

EID: 33750506989     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2006.02.028     Document Type: Article

References (17)

1. Burgess J.F., and Neugebauer C.A. Direct bonding of metals with a metal gaz eutectic. J. Electrochem. Soc. 122 (1975) 688-690
2. Yoshino Y.J. Role of oxygen in bonding copper to alumina. Am. Ceram. Soc. 72 (1989) 1322-1327
3. Jarrige J., Mexmain J., Michelet J. P., Guinet J., Guillaume B. and Hubert J. C. Proceedings of the 6th International Microelectronics Conference (ISHM), Tokyo, Japan. 30 Mai-1 Juin, 1990, 273.
4. Guinet J., Michelet J. P., Jarrige J. and Mexmain J. In ISHM Proceedings 8th European Hybrid Microelectronics Conference, Rotterdam (Netherlands), 1991, pp. 503-513.
5. Kara-Slimane A., Juve D., Leblond E., and Tréheux D. Joining of AlN with metals and alloys. J. Europ. Ceram. Soc. 20 (2000) 1829-1838
6. Jarrige J., Michelet J.P., and Mexmain J. Frittage naturel du nitrure d'aluminium en présence d'ajouts yttriés: relations microstructure, conductivité thermique, teneur en oxygène. Silicates Industriels 9-10 (1993) 199-208
7. Leroux V., Labbe J.C., Shanahan M.E.R., Tétard D., and Goujaud J.F. Contact angle and surface tension measurements on a metal drop by image processing and numerical calculation. J. High Temp. Chem. Proc. 4 3 (2000) 351-364
8. 3 detected by wetting experiments. Acta Metall. Mater. 44 5 (1996) 1927-1936
9. Diemer M., Neubrand A., Trumble K.P., and Rodel J. Influence of oxygen partial pressure and oxygen content on the wettability in the copper-oxygen-alumina system. J. Am. Ceram. Soc. 82 10 (1999) 2825-2832
10. Ownby P.D., and Liu J. Surface energy of liquid copper and single crystal sapphire and the wetting behaviour of copper on sapphire. J. Adhes. Sci. Technol. 2 4 (1988) 255-269
11. Mehrotra S.P., and Chaklader A.C.D. Interfacial reactions between molten metals and sapphire substrates. Metall. Trans. B 16B (1985) 567-575
12. 3 and graphite. J. Am. Ceram. Soc. 55 6 (1972) 300-303
13. O'Brien T.E., and Chaklader A.C.D. Effect of oxygen on the reaction between copper and sapphire. J. Am. Ceram. Soc. 57 8 (1974) 329-332
14. Kara-Slimane A., Mbongo B., and Tréheux D. Adhesion and reactivity in the copper-alumina system: influence of oxygen and silver. J. Adhes. Sci. Technol. 13 1 (1999) 35-48
15. Joyeux T., Jarrige J., Labbe J.C., Lecompte J.P., and Alexandre T. Oxygen influence on wetting and bonding between copper and aluminium nitride. Proceedings of the 7th ECERS, Bruges (Belgique). 9-13 September 2001 (2001) 535-538 vol. 206-213
16. Joyeux T., El Ganaoui M., Jarrige J., Labbe J. C., Lecompte J. P. Réalisation d'un assemblage Cu/AlN par liaison directe avec amélioration des propriétés thermiques, Actes du colloque sur les innovations dans les matériaux frittés. Poitiers 3-5 Juillet 2001. IV-11, 1-6.
17. e siècle (2001), Elsevier 621-626