Thermal profile of a high-density data center: Hot spot heat fluxes of 512 W/ft2

ASHRAE Transactions

Volumn 111 PART 2, Issue , 2005, Pages 765-777

  Schmidt, Roger ^a,b   Lyengar, Madhusudan ^a,b   Beaty, Don ^a,c   Shrivastava, Saurabh ^a,d  

^a ASHRAE ^*

^b IBM   (United States)

^c DLB Associates Inc   (United States)

^d BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIRFLOW; DATA CENTER; INLET AIR TEMPERATURES;

AIR CONDITIONING; COMPUTATIONAL FLUID DYNAMICS; COOLING SYSTEMS; HEAT FLUX; MATHEMATICAL MODELS; THERMAL EFFECTS;

OFFICE BUILDINGS;

EID: 29144443613     PISSN: 00012505     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. ASHRAE. 2004. Thermal Guidelines for Data Processing Environments. Atlanta: American Society of Heating, Refrigerating and Air-Conditioning Engineers, Inc.
2. ASHRAE. 2005. Datacom Equipment Power Trends and Cooling Applications. Atlanta: American Society of Heating, Refrigerating and Air-Conditioning Engineers, Inc.
3. Kang, S., R. Schmidt, K. Kelkar, and S. Patankar. 2001. A methodology for the design of perforated tiles in raised floor data centers using computational flow analysis. IEEE-CPMT Journal 24(2): 177-183.
4. Patel, C., C. Bash, L. Belady, L. Stahl, and D. Sullivan. Computational fluid dynamics modeling of high compute density data centers to assure system inlet air speci fications. Proceedings of Ipack' 01, The Pacific Rim/ ASME International Electronics Packaging Technical Conference and Exhibition, Kauai, Hawaii.
5. Schmidt, R.R. 2004. Thermal profile of a high density data center - Methodology to thermally characterize a data center. ASHRAE Transactions 110(2). Atlanta: American Society of Heating, Refrigerating and Air-Conditioning Engineers, Inc.
6. Schmidt, R. 1997. Thermal management of office data processing centers. Advances in Electronic Packaging 1997 (Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference, INTER pack '97), Vol. 2, EEP-Vol 19-2, Kohala Coast, Hawaii, June 15-19, 1997, pp. 1995-2010.
7. Schmidt, R., K. Karki, K. Kelkar, A. Radmehr, and S. Patankar. 2001. Measurements and predictions of the flow distribution through perforated tiles in raised floor data centers. Advances in Electronic Packaging 2001 (Proceedings of IPACK '01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), vol. 2, paper IPACK 2001-15728, Kauai, Hawaii, July 8-13, 2001, pp. 905-914.
8. Schmidt, R., and E. Cruz. 2002. Raised floor computer data center: Effect on rack inlet temperatures of exiting both the hot and cold aisle. Itherm Conference, San Diego, pp. 580-594.
9. Tate Access Floors. 2002. Technical Bulletin #216, Controlling air leakage from raised access floor cavities, 11-08-02.
10. Uptime Institute. Heat density trends in data processing, computer systems and telecommunications equipment. www.uptimeinstitute.org.