Automatic measurement and grading of LED dies on wafer by machine vision

Proceedings of the 2007 4th IEEE International Conference on Mechatronics, ICM 2007

Volumn , Issue , 2007, Pages

  Wu, Hsien Huang P ^a   Yang, Jing Guang ^a   Hsu, Ming Mao ^a   Wu, Chia Ju ^a  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; COMPUTER VISION; DIES; ELECTRONIC EQUIPMENT TESTING; LIGHTING; MECHATRONICS; OPTICAL DATA PROCESSING; SPEED;

INTERNATIONAL CONFERENCES; MACHINE VISION; OPTICAL MEASUREMENTS;

LIGHT EMITTING DIODES;

EID: 50649114213     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMECH.2007.4279980     Document Type: Conference Paper

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