Q-enhanced fold-and-bond MEMS inductors

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS

Volumn , Issue , 2008, Pages 869-872

  Chen, Po Jui ^a   Kuo, Wen Cheng ^a,b   Li, Wen ^a   Yang, Yao Joe ^b   Tai, Yu Chong ^a  

^a California Institute of Technology   (United States)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Bonding; Flexible; Inductor; Parylene; Quality factor

Indexed keywords

ELECTRIC INDUCTORS; FILM THICKNESS; Q FACTOR MEASUREMENT; SUBSTRATES;

BONDING; FABRICATION TECHNOLOGIES; FLEXIBLE; FOLDINGS; INDUCTOR; MEMS INDUCTOR; MICROFABRICATED; PARYLENES; QUALITY FACTORS; WIRELESS SENSING;

MICROFABRICATION;

EID: 50249144126     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NEMS.2008.4484461     Document Type: Conference Paper

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