High frequency xyz-axis single-disk silicon gyroscope

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2008, Pages 856-859

  Johari, Houri ^a   Shah, Jalpa ^a   Ayazi, Farrokh ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; CONSUMER ELECTRONICS; DISKS (STRUCTURAL COMPONENTS); ELECTRONICS INDUSTRY; ENCAPSULATION; GYROSCOPES; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; NONMETALS; REACTIVE ION ETCHING; ROTATION; SILICON; SINGLE CRYSTALS; TOOLS;

AXIS ROTATION; CONSUMER ELECTRONICS APPLICATIONS; FAST RESPONSE TIME; FORM FACTORS; FREQUENCY RANGING; HIGH FREQUENCIES; HIGH-FREQUENCY OPERATIONS; HIGH-QUALITY FACTORS; IN-PLANE; INTERNATIONAL CONFERENCES; MICRO-ELECTRO MECHANICAL SYSTEMS; OUT-OF PLANE; OUT-OF-PLANE MODES; ROTATION RATES; SINGLE-CRYSTAL-SILICON; THREE-AXIS; WAFER-LEVEL ENCAPSULATION;

SILICON WAFERS;

EID: 50149094687     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2008.4443791     Document Type: Conference Paper

References (5)

1. S. S. Nasiri, "Method of making an X-Y dual mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging," Patent No., US6939473 B2, Sep. 6, 2005.
2. S. Lewis, et al, "Integrated sensor and electronics processing for >10∧8 iMEMS inertial measurement unit components" in Tech. Dig. IEDM 2003, Washington, DC, Dec. 2003, pp. 39.1.1-39.1.4.
3. H. Johari and F. Ayazi, "High frequency capacitive disk gyroscopes in (100) and (111) silicon," Proceedings IEEE Conference on MEMS, Kobe, Japan, Jan. 2007, pp. 47-50.
4. F. Ayazi and K. Najafi, "A HARPSS Polysilicon Vibrating Ring Gyroscope," IEEE/ASME JMEMS, June 2001, pp. 169-179.
5. M. F. Zaman, et al, "High Performance Matched-Mode Tuning Fork Gyroscope," Proceedings IEEE Conference on MEMS, Jan. 2006, pp. 66-69.