Wafer level bonding of mems devices using ceramic lids

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1601-1605

  Dory, Thomas S ^a   Read, Bill ^a   Arana, Leonel R ^a   Heck, John M ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Ceramic; RF MEMS; Wafer level bonding

Indexed keywords

BONDING; CERAMIC MATERIALS; ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; TEMPERATURE DISTRIBUTION; THERMAL EXPANSION;

ELEVATED TEMPERATURES; RF MEMS; WAFER LEVEL BONDING;

SILICON WAFERS;

EID: 32844461566     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73377     Document Type: Conference Paper

References (4)

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3. [2] Chandran, B., Schmidt, W.F., Gordon, M.H., "A novel bonding technique to bond CTE mismatched devices," 1996 Electronic Compo.
4. A. E. vol and I. K. Kagan, eds., Handbook of Binary Metallic Systems, vol. 3, Oxonian Press PVT.LTD., 1986.