Two capillary solutions for ultra-fine-pitch wire bonding and insulated wire bonding

Microelectronic Engineering

Volumn 84, Issue 2, 2007, Pages 362-367

  Goh, K S ^a   Zhong, Z W ^b  

^a SPT Asia Pte Ltd   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Capillary; Insulated wire; Microelectronics packaging; Ultra fine pitch; Wire bonding

Indexed keywords

BONDING; ELECTRIC INSULATION; ELECTRIC WIRE; PROBLEM SOLVING;

CAPILLARY; INSULATED WIRES; MICROELECTRONICS PACKAGING; ULTRA-FINE PITCH; WIRE BONDING;

ELECTRONICS PACKAGING;

EID: 33846322914     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.11.002     Document Type: Article

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