Spray coating of photoresist for realizing through-wafer interconnects

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 831-836

  Pham, Nga P ^a   Bulcke, Mathieu Vanden ^a   De Moor, Piet ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; COMPUTER NETWORKS; ELECTRIC CONNECTORS; ELECTRONICS PACKAGING; PESTICIDES; SOLUTIONS; SPRAYING; THREE DIMENSIONAL;

PACKAGING TECHNOLOGIES; SPRAY COATINGS; THROUGH-WAFER INTERCONNECTS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50049094158     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342820     Document Type: Conference Paper

References (10)

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4. Pham, N.P. et al, "Spray coating of photoresist for pattern transfer on high topography surfaces". J Micromech. Microeng. 15 (2005), pp . 691-697.
5. th IEEE Electronics Packaging Technology Conference, Singapore, December 6-8, 2005
6. "Technical Information for AZ Products", Clarian Corporation, Business Unit Electronic Materials, Somerville, NJ.
7. T. Luxbacher et al, "Spray coating of photoresist for MEMS, interconnects, and advanced packaging applications", Sensors, vol 16, No7, July 1999, pp. 61-64.
8. th IEEE Electronics Packaging Technology Conference, Singapore, December 10-12, 2003, pp. 773-776.
9. Sze, S.M. Semiconductor devices- Physics and Technology. Wiley (1985).
10. "EV Group Nano Spray Technology" at http://www.EVGroup.com.