Low temperature a-SiC/Si direct bonding technology for MEMS/NEMS

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 2075-2078

  Du, Jiangang ^a   Zorman, Christian A ^a  

^a Case Western Reserve University   (United States)

Author keywords

Direct bonding; Silicon carbide; Vacuum sealed cavities

Indexed keywords

ACTUATORS; AMORPHOUS MATERIALS; AMORPHOUS SILICON; MICROSYSTEMS; NONMETALS; OPTICAL DESIGN; SENSORS; SILICON; TECHNOLOGY; TECHNOLOGY TRANSFER; THICK FILMS; THIN FILM DEVICES; THIN FILMS; TRANSDUCERS;

A-SIC:H; CAPPING LAYERS; DEEP RESERVOIRS; DIRECT BONDING; FILM BONDING; FILM TRANSFER; HYDROGENATED SILICON CARBIDE; INTERNATIONAL CONFERENCES; LOW TEMPERATURE; NANO GAPS; PROCESS TEMPERATURES; PROTOTYPE STRUCTURES; SIC FILMS; SOLID-STATE SENSORS; TRANSFER PROCESSES; VACUUM SEALED CAVITIES;

SILICON CARBIDE;

EID: 50049093462     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300573     Document Type: Conference Paper

References (5)

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5. J. B. Summers, R. Parro, M. C. Scardelletti, and C. A. Zorman, SPIE Photonics West, 2007 (in press)