Realtime 3D stress measurement in curing epoxy packaging

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 2083-2086

  Richter, J ^a   Hyldgard A ^a   Birkelund, K ^a   Hansen, O ^a   Thomsen, E V ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Epoxy; Packaging; Stress sensor

Indexed keywords

ACTUATORS; CURING; DRYING; INSTRUMENTS; NONMETALS; PAINTING; SENSORS; SILICON; STRESS MEASUREMENT; TRANSDUCERS;

3D STRESS; EPOXY; EPOXY CURING; IN-PLANE; INTERNATIONAL CONFERENCES; MICRO-SYSTEM PACKAGING; NORMAL STRESSES; NOVEL METHODS; PACKAGING; PACKAGING INDUCED STRESS; PIEZO RESISTORS; REAL TIME; ROOM TEMPERATURES; SILICON CHIPS; SOLID-STATE SENSORS; STRESS SENSOR; STRESS SENSORS;

MICROSYSTEMS;

EID: 50049090825     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300575     Document Type: Conference Paper

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