Electrical design of a low cost and high performance plastic ball grid array package - NuBGA

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 1081-1086

  Chou, Tai Yu ^a   Wu, Frank ^a   Lau, John ^a   Chen, Kuan Luen ^a  

^a Express Packaging Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CROSSTALK; ELECTRIC PROPERTIES; ELECTRIC VARIABLES MEASUREMENT; PLASTICS APPLICATIONS; SPURIOUS SIGNAL NOISE; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS; TIME DOMAIN ANALYSIS;

PLASTIC BALL GRID ARRAYS (PBGA); SPLIT VIA CONNECTIONS (SVC); SPLIT WRAP AROUND (SWA);

ELECTRONICS PACKAGING;

EID: 0030654129     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)