Effect of Ge on the SnAgCu/Cu soldering interface

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 29, Issue 7, 2008, Pages

  Meng, Gongge ^a   Yang, Tuoyu ^b   Chen, Leida ^c   Wang, Shizhen ^a   Li, Caifu ^d  

^a HARBIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b ANHUI SCIENCE AND TECHNOLOGY UNIVERSITY   (China)

^c DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^d INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Aging; Ge; Interface; Lead free solder

Indexed keywords

ARSENIC COMPOUNDS; BRAZING; CHEMICAL ELEMENTS; CHEMICAL PROPERTIES; CHLORINE COMPOUNDS; COMPUTER AIDED DESIGN; COPPER; COPPER ALLOYS; INTERFACIAL ENERGY; INTERMETALLICS; LEAD; METALS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SOLDERING; SOLDERING ALLOYS; TIN; TITANIUM COMPOUNDS; WELDING;

AGING; CAD SOFTWARES; ENERGY DISPERSIVE X-RAY ANALYZER; GE; GROWTH TRENDS; INTERFACE; INTERFACIAL COMPOSITION; INTERFACIAL MICROSTRUCTURES; INTERMETALLIC COMPOUND THICKNESS; LEAD-FREE SOLDER; MAIN GROUP; PEBBLE SHAPE; PERIODIC TABLES; PHYSICAL AND CHEMICAL PROPERTIES; SCANNING ELECTRON MICROSCOPES;

GERMANIUM;

EID: 50049087020     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

1. Habu K, Takeda N, Watanabe H, et al. Development of lead-free solder alloys of the Ge doped Sn-Ag-Bi system[C]//Proceedings of First International Symposium on Environmentally Conscious Design and Inverse Manufacturing. Los Alamitos, CA, USA: IEEE (Institute of Electrical and Electronic Engineers) Computer Society, 1999: 606-609.
2. Cho W, Han K, Yi Y, et al. Thermal oxidation study on lead-free solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge[J]. Advanced Engineering Materials, 2006, 8(1-2): 111-114.
3. Lee R, Sin S, Jeon K, et al. Sn2.5Ag0.5Cu lead free solder ball wiui 'Ge' and 'Ni'[C]//IEEE Components, Packaging and Manufacturing Technology. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces. Irvine, CA: Institute of Electrical and Electronics Engineers Inc, 2005: 121-125.
4. Chuang Chiang-ming, Lin Kwang-lung. Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate[J]. Journal of Electronic Materials, 2003, 32(12): 1426-1431.
5. Chuang Chiang-ming, Shi Po-cheng, Lin Kwang-lung. Interfacial reaction between Sn-Ag-Cu, Sn-Ag-Cu-Ni-Ge lead-free solders and metallic substrates[C]//Proceedings of the 4th International Symposium on Electronic Materials and Packaging. Piscataway, NJ, USA: IEEE, 2002: 360-365.