Sn2.5Ag0.5Cu lead free solder balls with "Ge" and "Ni"

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 121-125

  Lee, Redwood ^a   Sin, Wha Soo ^a   Jeon, Jong Keun ^a   Kim, Heui Seog ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; ENVIRONMENTAL PROTECTION; OPTIMIZATION; SEMICONDUCTOR MATERIALS; SOLDERED JOINTS; TIN ALLOYS;

FATIGUE BENDING; LEAD-FREE SOLDERS; MOBILE ELECTRONICS; SOLDER MATERIALS;

SOLDERING ALLOYS;

EID: 33746474070     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432060     Document Type: Conference Paper

References (3)

1. Sung K. Kang, "Lead-Free Solders and Processing Issues Relevant to Micorelectronics"ISMP 2005 Seoul Korea, September 24-25 2003.
2. Jedec (JESD22-B111)
3. Ho Jeong Moon, "Brittle Facture of Pb-free Solder Joint in Ni/Au finished FBGA MCP Mounted on OSP Board Subected to Bending Impact Load" IMAPS 2004 Seoul Korea,