Diffusion bonding of commercially pure titanium to low carbon steel using a silver interlayer

Materials Characterization

Volumn 59, Issue 10, 2008, Pages 1481-1490

  Atasoy, Evren ^a   Kahraman, Nizamettin ^b  

^a Tokat Adocim Cement Factory   (Turkey)

^b KARABUK UNIVERSITY   (Turkey)

Author keywords

Diffusion welding bonding; Interlayer; Microstructure; Titanium

Indexed keywords

CARBON STEEL; DIFFUSION BONDING; HARDNESS; HARDNESS TESTING; IMAGING TECHNIQUES; OPTICAL MICROSCOPY; SEMICONDUCTOR DOPING; SILVER; SPECTROMETERS; SPECTROMETRY; STEEL; SUPERCONDUCTING WIRE; TESTING; TITANIUM;

COMMERCIALLY PURE TITANIUM; DIFFUSION TIME; DIFFUSION WELDING/BONDING; ELEMENTAL ANALYSES; ENERGY DISPERSIVE SPECTROMETRY; HARDNESS TESTS; HARDNESS VALUES; INTERFACE PROPERTIES; INTERFACE STRENGTH; INTERLAYER; INTERLAYER MATERIALS; LOW CARBON STEEL; MICROSTRUCTURE; OPTICAL-; TEMPERATURE RISE; TENSILE-SHEAR TESTS;

DIFFUSION;

EID: 49949114208     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2008.01.015     Document Type: Article

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