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Volumn 59, Issue 10, 2005, Pages 1134-1137

A study on the solid-state welding of boron-doped Ni3Al-AISI 304 stainless steel couple

Author keywords

AISI 304; Diffusion; Intermetallic alloys and compounds; Ni3al+B; Solid state welding

Indexed keywords

AUSTENITE; BONDING; BORON; BRITTLENESS; DIFFUSION; DOPING (ADDITIVES); ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; STAINLESS STEEL; THERMAL EXPANSION; WELDING; X RAY DIFFRACTION ANALYSIS;

EID: 14644392905     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2004.08.042     Document Type: Article
Times cited : (16)

References (11)
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  • 5
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    • Cahn, R.W.1
  • 7
    • 0031084385 scopus 로고    scopus 로고
    • The use of Kirkendall Effect for calculating intrinsic diffusion coefficients in a 316L/Ti6242 diffusion bonded couple
    • March 1
    • Aleman I. Gutiérrez, and J.J. Urcola The use of Kirkendall Effect for calculating intrinsic diffusion coefficients in a 316L/Ti6242 diffusion bonded couple Scripta Materialia 36 5 1997 (March 1) 509B 515B
    • (1997) Scripta Materialia , vol.36 , Issue.5
    • Gutiérrez Aleman, I.1    Urcola, J.J.2
  • 8
    • 0003171562 scopus 로고
    • Alloy phase diagrams
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    • (1992) ASM Handbook , vol.3
  • 9
    • 0035979877 scopus 로고    scopus 로고
    • Diffusion bonding of a microduplex stainless steel to Ti-6Al-4V
    • N. Orhan, T.I. Khan, and M. Eroglu Diffusion bonding of a microduplex stainless steel to Ti-6Al-4V Scripta Materialia 45 2001 441 446
    • (2001) Scripta Materialia , vol.45 , pp. 441-446
    • Orhan, N.1    Khan, T.I.2    Eroglu, M.3
  • 10
    • 0036545177 scopus 로고    scopus 로고
    • Transient liquid phase bonding of a microduplex stainless steel using amorphous interlayers
    • T.I. Khan, N. Orhan, and M. Eroglu Transient liquid phase bonding of a microduplex stainless steel using amorphous interlayers Materials Science and Technology 18 2002 396 400
    • (2002) Materials Science and Technology , vol.18 , pp. 396-400
    • Khan, T.I.1    Orhan, N.2    Eroglu, M.3
  • 11
    • 0036174250 scopus 로고    scopus 로고
    • Diffusion bonding between Ti-6Al-4V alloy and microduplex stainless steel with copper interlayer
    • M. Eroglu, T.I. Khan, and N. Orhan Diffusion bonding between Ti-6Al-4V alloy and microduplex stainless steel with copper interlayer Materials Science and Technology 18 2002 68 72
    • (2002) Materials Science and Technology , vol.18 , pp. 68-72
    • Eroglu, M.1    Khan, T.I.2    Orhan, N.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.