Characterization of WC-Co/Ti6Al4V diffusion bonding joints using Ag as interlayer

Materials Characterization

Volumn 59, Issue 10, 2008, Pages 1407-1411

  Barrena, M I ^a   Gomez de Salazar J M ^a   Merino, N ^a   Matesanz, L ^a  

^a UNIVERSIDAD COMPLUTENSE DE MADRID   (Spain)

Author keywords

Diffusion bonding; Electron microscopy; Intermetallic alloys and compounds; Mechanical properties

Indexed keywords

COPPER; DIFFUSION BONDING; METALS; PHASE INTERFACES; SEMICONDUCTOR DOPING; SILVER; TITANIUM; TITANIUM ALLOYS; TITANIUM CARBIDE;

DIFFUSION BONDING JOINTS; ELECTRON MICROSCOPY; HARD METALS; INTER-METALLIC PHASES; INTERMETALLIC ALLOYS AND COMPOUNDS; JOINT INTERFACES; LOAD CONDITIONS; MECHANICAL PROPERTIES; OPTIMAL PARAMETERS; TEMPERATURE-TIME; TI-6AL-4V;

SILVER ALLOYS;

EID: 49949113672     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2007.12.008     Document Type: Article

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