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Volumn 52, Issue 3, 1999, Pages 365-368

Contact-reactive welding of titanium via a copper layer

Author keywords

Co interlayer thickness; Contact reactive welding; Weld phase composition

Indexed keywords

ANNEALING; COPPER; DIFFUSION IN SOLIDS; EVAPORATION; METALLIC FILMS; MICROHARDNESS; PHASE COMPOSITION; VACUUM TECHNOLOGY; WELDING; WELDS; X RAY ANALYSIS;

EID: 0033099832     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0042-207x(98)00310-8     Document Type: Article
Times cited : (13)

References (11)
  • 9
    • 9344234166 scopus 로고    scopus 로고
    • note
    • American Society for Testing Materials. Card File. Diffraction Data Cards and Alphabetical and Grouped Numerical Index of X-ray Diffraction Data. Philadelphia: Ed. ASTM, 1969.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.