Surface electrostatic damage by microprocess robotic machines: Diagnosis and reliability, process auditing, and remedies

IEEE Transactions on Device and Materials Reliability

Volumn 6, Issue 2, 2006, Pages 213-220

  Jacob, Peter ^a   Nicoletti, Giovanni ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

Assembly systems; Electrostatic discharge (ESD); Semiconductor device fabrication

Indexed keywords

ELECTRIC DISCHARGES; ELECTRONIC EQUIPMENT; ELECTROSTATICS; FABRICATION;

ASSEMBLY SYSTEMS; ELECTROSTATIC DISCHARGE (ESD); SEMICONDUCTOR DEVICE FABRICATIONS;

ROBOTICS;

EID: 33748107182     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2006.877863     Document Type: Conference Paper

References (14)

1. P. Jacob and U. Thiemann, ESD-Related Impacts Directly to Device Surfaces by Processing and Their Effects on Reliability and Field Return Failures, Tagungsband S. ESD Forum 2003. Nördlingen, Germany: Interessengemeinschaft ESD e.V., pp. 131-137.
2. P. Jacob and J. C. Reiner, "Electrostatic effects on semiconductor tools," J. Microelectron. Rel., vol. 44, pp. 1787-17923, 2004.
3. J. Orloff, M. Utlaut, and L. Swanson, High Resolution Focused Ion Beamn-FIB and Its Applications. Norwell, MA: Kluwer, 2003, pp. 96-201.
4. D. G. Bellmore, "Controlling ESD in automated handling equipment," in White Paper of Universal Instruments. Binghamton, NY: Universal Instruments SMT Laboratory. [Online]. Available: http://www.uic.com/ wcms/images2.nsf/(GraphicLib)/ControllingESD.pdf
5. J. Paasi, P. Tamminen, H. Salmela, J.-P. Leskinen, and T. Viheriäkoski, "ESD control in automated placement process," in Proc. EOS/ESD Symp. EOS-27, Anaheim, California, Sep. 11-15, 2004.
6. M. Roesner and D. Wallis, "Grinding and dicing 300 mm wafers," Future Fab Int., vol. 11, no. 20, Jun. 2001. [Online]. Available: http://www.future-fab.com/documents.asp?grID=217&d_ID=658
7. P. Jacob and J. C. Reiner, "Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing," J. Microelectron. Rel., vol. 45, no. 7/8, p. 1174, Jul. 2005.
8. ESD Association Standard for the Development of an Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment, Aug. 4, 1999. ANSI/ESD S.20.20-1999.
9. ESD Association Standard Practice for Protection of Electrostatic Discharge Susceptible Items - Automated Handling Equipment (AHE), Feb. 6, 2000. ESD SP10.1-2000.
10. O. Breitenstein, J. P. Rakotoniaina, F. Altmann, T. Riediger, and O. Schreer, "Thermal failure analysis by lock-in thermography," in Microelectronic Failure Analysis Desk Reference. Materials Park, OH: ASM International, 2004, pp. 398-405.
11. H. A. Gieser, "ESD testing: HBM to very fast TLP," in Proc. ESREF (Tutorial), Zurich, 2004.
12. A. Olney, B. Gifford, J. Guravage, and A. Righter, "Real-world printed circuit board ESD failures," Microelectron. Rel., vol. 45, no. 2, pp. 287-295, Feb. 2005. case study 2.
13. W. Lukaszek, "How to avoid charging damage in IC manufacturing," in Proc. Int. Semicond. Technol. Conf., Shanghai, China, Sep. 14-17, 2004. [Online], Available: www.charm-2.com/ISTC2004_web.pdf
14. _, "Use of EEPROM-based sensors in investigating physical mechanisms responsible for charging damage," in Proc. 40th Annu. Int. Rel. Phys. Symp., Dallas, TX, Apr. 2002, pp. 346-353.