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Volumn 38, Issue 4, 2008, Pages 693-697

Investigation on oxidation resistance of Sn-8Zn-3Bi lead-free solder alloys

Author keywords

Al; Lead free solder; Oxidation resistance; P; Sn 8Zn 3Bi

Indexed keywords

ALLOYS; ALUMINUM; BISMUTH PLATING; BRAZING; CHEMICAL ELEMENTS; CHEMICAL OXYGEN DEMAND; LEAD; METALLIC COMPOUNDS; NONMETALS; OXIDATION; OXIDATION RESISTANCE; OXYGEN; TIN ALLOYS; TRACE ANALYSIS; TRACE ELEMENTS; WELDING; X RAY ANALYSIS; X RAY DIFFRACTION ANALYSIS; ZINC;

EID: 49549108171     PISSN: 10010505     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (2)

References (8)
  • 1
    • 33751404611 scopus 로고    scopus 로고
    • Effect of alloying elements on the high-temperature oxidation resistance of Sn-Zn based lead-free solder
    • in Chinese
    • Ren Xiaoxue, Li Ming, Mao Dali. Effect of alloying elements on the high-temperature oxidation resistance of Sn-Zn based lead-free solder [J]. Electronic Components and Materials, 2004, 23(11): 39-44. (in Chinese)
    • (2004) Electronic Components and Materials , vol.23 , Issue.11 , pp. 39-44
    • Ren, X.1    Li, M.2    Mao, D.3
  • 2
    • 0032187661 scopus 로고    scopus 로고
    • High temperature oxidation of a Sn-Zn-Al solder
    • Lin Kwanglung, Liu Tzyping. High temperature oxidation of a Sn-Zn-Al solder [J]. Oxidation Metals, 1998, 50(3/4): 255-267.
    • (1998) Oxidation Metals , vol.50 , Issue.3-4 , pp. 255-267
    • Lin, K.1    Liu, T.2
  • 3
    • 0004273181 scopus 로고    scopus 로고
    • A guide for assembly of lead-free electronics
    • IPC Roadmap. Washington DC: National Academy Press
    • IPC Roadmap. A guide for assembly of lead-free electronics [R]. Washington DC: National Academy Press, 2000.
    • (2000)
  • 4
    • 0038818002 scopus 로고    scopus 로고
    • Physical metallurgy in lead-free electronic solder development
    • Subramanian K N, Lee J G. Physical metallurgy in lead-free electronic solder development [J]. Journal of Electronic Materials, 2003, 5(6): 26-32.
    • (2003) Journal of Electronic Materials , vol.5 , Issue.6 , pp. 26-32
    • Subramanian, K.N.1    Lee, J.G.2
  • 5
    • 30844432199 scopus 로고    scopus 로고
    • Study on Sn-Ag oxidation and feasibility of room temperature bonding of Sn-Ag-Cu solder
    • Wang Y H, Howlader M R, Nishida K. Study on Sn-Ag oxidation and feasibility of room temperature bonding of Sn-Ag-Cu solder [J]. Materials Transactions, 2005, 11(24): 31-36.
    • (2005) Materials Transactions , vol.11 , Issue.24 , pp. 31-36
    • Wang, Y.H.1    Howlader, M.R.2    Nishida, K.3
  • 6
    • 0038498834 scopus 로고    scopus 로고
    • Adhesion strength of the Sn-9Zn-xAg/Cu interface
    • Chang Tao-Chin. Adhesion strength of the Sn-9Zn-xAg/Cu interface [J]. Journal of Electronic Materials, 2003, 32(6): 516-522.
    • (2003) Journal of Electronic Materials , vol.32 , Issue.6 , pp. 516-522
    • Chang, T.-C.1
  • 7
    • 49549105257 scopus 로고    scopus 로고
    • in Chinese
  • 8
    • 19744373254 scopus 로고    scopus 로고
    • Properties of low melting point Sn-Zn-Bi solders
    • Zhou Jian, Sun Yangshan, Xue Feng. Properties of low melting point Sn-Zn-Bi solders [J]. Journal of Alloys and Compounds, 2005, 39(7): 260-264.
    • (2005) Journal of Alloys and Compounds , vol.39 , Issue.7 , pp. 260-264
    • Zhou, J.1    Sun, Y.2    Xue, F.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.