Structure property correlation of epoxy resins under the influence of moisture; and comparison of Diffusion Coefficient with MD-simulations

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Volumn , Issue , 2008, Pages

  Dermitzaki, E ^a   Wunderle, B ^a   Bauer, J ^a   Walter, H ^a   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AMINES; AROMATIC COMPOUNDS; BENZENE; BOUNDARY CONDITIONS; BOUNDARY VALUE PROBLEMS; DIFFUSION; DYNAMICS; ELECTRONICS INDUSTRY; EPOXY RESINS; ERROR ANALYSIS; EXPERIMENTS; FREE VOLUME; GLASS TRANSITION; HARDENING; MICROELECTRONICS; MOISTURE; MOLECULAR DYNAMICS; ORGANIC COMPOUNDS; PAINTING; PHOTOMASKS; QUANTUM CHEMISTRY; RESINS; SEMICONDUCTOR DOPING; STOICHIOMETRY; THERMAL SPRAYING;

AMINE HARDENER; BOUNDARY CONDITIONING; CLASSICAL FORCE FIELDS; CO-EFFICIENT OF THERMAL EXPANSION; DIFFUSION CO-EFFICIENT; DIFFUSION EXPERIMENTS; FAILURE MECHANISMS; GLASS TRANSITION TEMPERATURE TG; HUMID ENVIRONMENTS; INITIAL CONDITIONS; INTERNATIONAL CONFERENCES; MECHANICAL CHARACTERIZATIONS; MICRO-ELECTRONIC PACKAGING; MICRO-SYSTEMS; MULTI-PHYSICS SIMULATION; STRUCTURE-PROPERTY CORRELATIONS; WATER-UPTAKE;

THERMAL EXPANSION;

EID: 49249088642     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2008.4525087     Document Type: Conference Paper

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