In-line process window monitoring using voltage contrast inspection

ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

Volumn , Issue , 2008, Pages 19-24

  Patterson, Oliver D ^a   Kang, Hyoung H ^a   Wu, Kevin ^b   Feichtinger, Petra ^b  

^a IBM   (United States)

^b KLA TENCOR CORPORATION   (United States)

Author keywords

Contacts; e beam inspection; Inspection SEM; Process window; Voltage contrast

Indexed keywords

ELECTRIC CONDUCTIVITY; SEMICONDUCTOR MATERIALS; VOLTAGE MEASUREMENT; WINDOWS;

CONTACT SIZE; CONTACTS; E-BEAM INSPECTION; IN-LINE; INSPECTION SEM; PROCESS CONDITIONS; PROCESS WINDOW; PROCESS WINDOWS; RULE BASED; SEMICONDUCTOR MANUFACTURING; SINGLE WAFERS; TEST STRUCTURES; TURN-AROUND; VOLTAGE CONTRAST;

PROCESS ENGINEERING;

EID: 49149110149     PISSN: 10788743     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASMC.2008.4529000     Document Type: Conference Paper

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