Dynamical dislocation emission processes from twin boundaries

Applied Physics Letters

Volumn 93, Issue 4, 2008, Pages

  Wang, Y B ^a   Wu, B ^a   Sui, M L ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER;

ATOMIC STEPS; DISLOCATION EMISSION PROCESSES; DISLOCATION REACTIONS; DISLOCATION SOURCES; ELECTRODEPOSITED COPPER; HIGH-DENSITY; IN-SITU; NANOSCALE GROWTH TWINS; PARTIAL DISLOCATIONS; TENSILE STRAINING; TRANSMISSION ELECTRON; TWIN BOUNDARIES; UNDERLYING MECHANISM;

COPPER PLATING;

EID: 49149106455     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2965637     Document Type: Article

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