Micro via and line patterning for PCB using imprint technique

Current Applied Physics

Volumn 8, Issue 6, 2008, Pages 675-678

  Ra, Seunghyun ^a   Lee, Choonkeun ^a   Cho, Jaechoon ^a   Lee, Sangmoon ^a   Lee, Jungwoo ^a   Hong, Myungho ^a   Kwak, Jungbok ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

Dielectric resins; Imprint; PCB; Via holes

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; EPOXY RESINS; NANOIMPRINT LITHOGRAPHY; PAINTING; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; RESINS; SILICA; SILICATE MINERALS; SILICON COMPOUNDS; TELECOMMUNICATION; TELECOMMUNICATION EQUIPMENT;

ELECTRONIC COMPONENTS; ELECTRONIC DEVICES; LINE PATTERNING; LITHOGRAPHY PROCESSES; MICRO SIZE; VIA HOLES;

PRINTED CIRCUIT BOARDS;

EID: 48949118096     PISSN: 15671739     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cap.2007.04.048     Document Type: Article

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