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Volumn , Issue , 2006, Pages
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PECVD silicon carbide as a chemically-resistant thin film packaging technology for microfabricated antennas
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINA SUBSTRATES;
CHAMBER PRESSURES;
COPLANAR WAVEGUIDE (CPW) FEED;
DUAL FREQUENCY;
FOLDED SLOT;
MICROFABRICATED ANTENNAS;
MICROWAVE TECHNOLOGY;
PACKAGING TECHNOLOGIES;
PHYSICAL INTEGRITY;
PLANAR ANTENNAS;
PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD);
POWER LEVELING;
RETURN LOSS (RL);
RF PERFORMANCE;
SIC FILMS;
SILICON CARBIDE (SIC);
ANTENNA ACCESSORIES;
ANTENNA ARRAYS;
ANTENNAS;
CHEMICAL REACTIONS;
CHEMICAL RESISTANCE;
FABRICATION;
HEALTH;
METALLIZING;
MICROFABRICATION;
MICROWAVE ANTENNAS;
MICROWAVE DEVICES;
MICROWAVES;
NONMETALS;
OPTICAL DESIGN;
PLASMA DEPOSITION;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
RELIABILITY;
SILICON;
SILICON CARBIDE;
SULFATE MINERALS;
TECHNOLOGY;
THICK FILMS;
THIN FILM DEVICES;
THIN FILMS;
VAPOR DEPOSITION;
SLOT ANTENNAS;
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EID: 48749122100
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/WAMICON.2006.351933 Document Type: Conference Paper |
Times cited : (9)
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References (5)
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