Si micromachined conformal package for a K-band low noise HEMT amplifier

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1997, Pages 517-520

  Robertson, Stephen V ^a   Matloubian, Mehran ^a   Case, Michael ^a   Katehi, Linda P B ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); COMPUTER SIMULATION; FLIP CHIP DEVICES; HIGH ELECTRON MOBILITY TRANSISTORS; INTEGRATED CIRCUIT LAYOUT; MICROMACHINING; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING INDIUM PHOSPHIDE;

INSERTION GAIN; INTEGRATED CONFORMAL PACKAGING; LOW NOISE AMPLIFIERS;

ELECTRONICS PACKAGING;

EID: 0030649256     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)