Novel thermoplastic bonding using a bulk metallic glass solder

Scripta Materialia

Volumn 59, Issue 8, 2008, Pages 905-908

  Suh, Jin Yoo ^a   Lohwongwatana, Boonrat ^b   Garland, Carol M ^a   Conner, R Dale ^c   Johnson, William L ^a   Suh, Daewoong ^d  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^b CHULALONGKORN UNIVERSITY   (Thailand)

^c CALIFORNIA STATE UNIVERSITY   (United States)

^d INTEL CORPORATION   (United States)

Author keywords

Bonding; Joining; Metallic glasses; Soldering; Supercooled liquid

Indexed keywords

ALLOYS; GLASS; GLASS BONDING; LIQUID METALS; REINFORCED PLASTICS; RHEOLOGY;

BULK METALLIC GLASS (BMGS); RHEOLOGICAL BEHAVIORS;

METALLIC GLASS;

EID: 48749111000     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2008.06.055     Document Type: Article

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