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Volumn , Issue , 2007, Pages 928-931

Manufacturable wafer-scale microstrip patch antennas

Author keywords

[No Author keywords available]

Indexed keywords


EID: 48349122622     PISSN: 15223965     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APS.2007.4395647     Document Type: Conference Paper
Times cited : (1)

References (6)
  • 2
    • 0028444637 scopus 로고
    • Improvement of microstrip patch antenna radiation patterns
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    • M.J. Vaughan, et al, "Improvement of microstrip patch antenna radiation patterns", IEEE Trans. on Antennas and Propagation, vol. 42, no.6, pp. 882-885, June 1994.
    • (1994) IEEE Trans. on Antennas and Propagation , vol.42 , Issue.6 , pp. 882-885
    • Vaughan, M.J.1
  • 3
    • 0038054499 scopus 로고    scopus 로고
    • Enhancement of rotordynamic performance of high-speed micro-rotors for power MEMS applications by precision deep reactive ion etching
    • N. Miki, C.J. Teo, L.C. Ho, and X.Zhang, "Enhancement of rotordynamic performance of high-speed micro-rotors for power MEMS applications by precision deep reactive ion etching", Sensors and Actuators A vol. 104, pp. 263-267, 2003.
    • (2003) Sensors and Actuators A , vol.104 , pp. 263-267
    • Miki, N.1    Teo, C.J.2    Ho, L.C.3    Zhang, X.4
  • 4
    • 0032753082 scopus 로고    scopus 로고
    • Characterization of a time multiplexed inductively coupled plasma etcher
    • January
    • Ayon A et al, "Characterization of a time multiplexed inductively coupled plasma etcher", J. Electrochem. Soc., vol.146, pp. 339-349, January 1999.
    • (1999) J. Electrochem. Soc , vol.146 , pp. 339-349
    • Ayon, A.1
  • 5
    • 48349124978 scopus 로고    scopus 로고
    • Analysis of DRIE Uniformity for MEMS
    • MS Thesis, MIT
    • T. F. Hill, "Analysis of DRIE Uniformity for MEMS", MS Thesis, MIT, 2004
    • (2004)
    • Hill, T.F.1
  • 6
    • 21844469745 scopus 로고    scopus 로고
    • Uniformity-improving dummy structures for deep reactive ion etching (DRIE) processes
    • S. Jensen et al, "Uniformity-improving dummy structures for deep reactive ion etching (DRIE) processes", Proc. SPIE, vol. 5715, pp. 39-46, 2005.
    • (2005) Proc. SPIE , vol.5715 , pp. 39-46
    • Jensen, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.