Phenolic molding compound filled with nonmetals of waste PCBs

Environmental Science and Technology

Volumn 42, Issue 2, 2008, Pages 624-628

  Guo, Jie ^a   Li, Jia ^a   Rao, Qunli ^a   Xu, Zhenming ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHARPY NOTCHED IMPACT STRENGTH; PHENOLIC MOLDING;

BENDING STRENGTH; PARTICLE SIZE ANALYSIS; PHENOLS; THERMAL EFFECTS;

PRINTED CIRCUIT BOARDS;

CELLULOSE; NONMETAL; PHENOL DERIVATIVE; PHENOLIC MOLDING COMPOUND; UNCLASSIFIED DRUG; ANILINE DERIVATIVE; CALCIUM CARBONATE; FORMALDEHYDE; MAGNESIUM OXIDE; METHENAMINE; NIGROSIN; PHENOL FORMALDEHYDE RESIN; PHENOL-FORMALDEHYDE RESIN; POLYCHLORINATED BIPHENYL; POLYMER; STEARIC ACID; STEARIC ACID DERIVATIVE; TALC;

BENDING STRENGTH; PARTICLE SIZE ANALYSIS; PHENOLS; PRINTED CIRCUIT BOARDS; THERMAL EFFECTS;

CELLULOSE; ENVIRONMENTAL DEGRADATION; NONMETAL; PCB; PHENOLIC COMPOUND; RECYCLING; REPLACEMENT;

ARTICLE; DEVICE; HEAT DEFLECTION TEMPERATURE; PARTICLE SIZE; POLLUTION; PRINTED CIRCUIT BOARD; STRENGTH; TEMPERATURE; CHEMISTRY; ELECTRONICS; ENVIRONMENTAL PROTECTION; HEAT; INDUSTRIAL WASTE; MECHANICAL STRESS; WOOD;

ANILINE COMPOUNDS; CALCIUM CARBONATE; CONSERVATION OF NATURAL RESOURCES; ELECTRONICS; FORMALDEHYDE; HEAT; INDUSTRIAL WASTE; MAGNESIUM OXIDE; METHENAMINE; PARTICLE SIZE; PHENOLS; POLYCHLORINATED BIPHENYLS; POLYMERS; STEARIC ACIDS; STRESS, MECHANICAL; TALC; WOOD;

EID: 40949096116     PISSN: 0013936X     EISSN: None     Source Type: Journal    
DOI: 10.1021/es0712930     Document Type: Article

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