Trench-isolated CMUT arrays with a supporting frame

Proceedings - IEEE Ultrasonics Symposium

Volumn 1, Issue , 2006, Pages 1955-1958

  Zhuang, Xuefeng ^a   Lin, Der Song ^a   Ergun, A Sanli ^b   Oralkan, Ömer ^a   Khuri Yakub, Butrus T ^a  

^a STANFORD UNIVERSITY   (United States)

^b SIEMENS CORPORATE RESEARCH   (United States)

Author keywords

CMUT; Supporting frame; Through wafer trench isolated interconnect

Indexed keywords

2D ARRAYS; ARRAY ELEMENTS; BULK SILICON; CARRIER WAFERS; CMUT; CONDUCTIVE SILICON; DEEP TRENCH ETCHING; DEVICE LAYERS; DEVICE WAFERS; ELECTRICAL CONNECTION; ELECTRICAL INTERCONNECTIONS; FLIP-CHIP BONDING; MECHANICAL SUPPORT; MESH STRUCTURES; MICROMACHINED; SILICON ON INSULATOR WAFERS; SILICON PILLAR; SUPPORTING FRAME; THROUGH-WAFER TRENCH-ISOLATED INTERCONNECT; TRENCH ISOLATION;

ELECTRIC CONNECTORS; FLIP CHIP DEVICES; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; ULTRASONIC TRANSDUCERS;

WAFER BONDING;

EID: 48149089640     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2006.494     Document Type: Conference Paper

References (5)

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2. Private communication with C. H. Cheng.
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