Stochastic high order basis functions for volume integral equation with surface roughness

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2007, Pages 73-76

  Moselhy, Tarek ^a   Daniel, Luca ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BASIS FUNCTIONS; COMPUTATIONALLY EFFICIENT; DISCRETIZATION; ENSEMBLE AVERAGES; HIGH ORDER BASIS FUNCTIONS; INTERCONNECT STRUCTURES; QUASISTATIC; STOCHASTIC FORMULATIONS; VOLUME INTEGRAL EQUATIONS; WIDE BANDS;

ELECTRONICS PACKAGING; INTEGRAL EQUATIONS; PROBABILITY DENSITY FUNCTION; SURFACE ROUGHNESS;

FUNCTIONS;

EID: 47949111074     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2007.4387127     Document Type: Conference Paper

References (7)

1. Z. Zhu, A. Demir, J. White, "A stochastic Integral Equation Method for Modeling the Rough Surface Effect on Interconnect Capacitance" ICCAD 2004.
2. H. Zhu, X. Zeng, W. Cai, J. Xue and D. Zhou, "A sparse grid based spectral stochastic collocation method for variations-aware capacitance extraction of interconnect under nanometer process technology", DATE 2007.
3. T. Moselhy and L. Daniel, "Stochastic Volumetric MQS Formulation for Interconnect Extraction with Surface Roughness." submitted to EPEP 2007.
4. L. Daniel, A. Sangiovanni-Vincentelli and J. White, "Proximity templates for modeling of skin and proximity effects on packages and high frequency interconnect", ICCAD 2002.
5. X. Hu, T. Moselhy, J. White and L. Daniel, "Optimization-based Wideband Basis Functions for Efficient Interconnect Extraction", DATE, 2007.
6. M. Kamon and M. J. Tsuk and J. White, "FASTHENRY: A Multipole-Accelerated 3-D Inductance Extraction Program" IEEE Trans. on Microwave Theory and Techniques, September 1994, vol. 42, no.9, p. 1750-1758.
7. R. Ghanem and P. Spanos, Stochastic Finite Elements: A Spectral Approach, Spring-Verlag, 1991.