Virtual metrology in RTP with WISR

15th IEEE International Conference on Advanced Thermal Processing of Semiconductors, RTP 2007

Volumn , Issue , 2007, Pages 101-104

  Aderhold, Wolfgang ^a   Iliopoulos, Ilias ^a   Hunter, Aaron ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED PROCESS CONTROLS; ANALYSIS OF DATUMS; APPLIED MATERIALS; DATA ANALYSIS; HIGH RESOLUTION PROCESSES; IF DATUMS; LAMP POWERS; METROLOGY DATUMS; MONITOR WAFERS; PHYSICAL SENSORS; PROCESS TOOLS; RADIAL POSITIONS; STATISTICAL REPRESENTATIONS; TEMPERATURE MAPS; TIME SERIES; TIME WINDOWS; VIRTUAL METROLOGIES; VIRTUAL SENSORS; WAFER IMAGES; WAFER PROCESSES; WAFER PROCESSING;

CRYSTALS; DATA STORAGE EQUIPMENT; ELECTRIC CONDUCTIVITY; INTELLIGENT CONTROL; INTERNET PROTOCOLS; RAPID THERMAL ANNEALING; SEMICONDUCTOR MATERIALS; SENSORS;

DATA VISUALIZATION;

EID: 47949089278     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RTP.2007.4383826     Document Type: Conference Paper

References (3)

1. W. Aderhold, S. Porch, A. Hunter, "REDUCTION OF PATTERN EFFECTS IN RTP CENTURA SYSTEM", 10th IEEE International Conference on Advanced Thermal Processing of Semiconductors - RTP 2002, pp. 69-73, September 2002
2. B. Lojek, "Wafer Temperature Non-uniformity due to Volumetric Absorption of Radiation," 12th IEEE International Conference on Advanced Thermal Processing of Semiconductors - RTP 2004, September 28-30, 2004.
3. I. Iliopoulos, W. Aderhold "Use of Virtual Metrology and APC for RTP Critical Anneals," 8th European Advanced Equipment Control/Advanced Process Control (AEC/APC) Conference, Dresden, 18-20 April 2007