Wafer temperature non-uniformity due to volumetric absorption of radiation

12th IEEE International Conference on Advanced Thermal Processing of Semiconductors, RTP 2004

Volumn , Issue , 2004, Pages 203-206

  Lojek, B ^a  

^a ATMEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EMISSIVITY; RAPID THERMAL PROCESSING; UN-DOPED REGIONS; WAFER TEMPERATURE;

ENERGY ABSORPTION; HEAT TRANSFER; RADIATION EFFECTS; THERMAL EFFECTS;

SILICON WAFERS;

EID: 28344454789     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Siegel, R., Howell, J. R., Thermal Radiation Heat Transfer, Hemisphere, Washington DC, 1992.
2. Sparrow, E.M., Cess, R. D., Radiation Heat Transfer, Hemisphere, Washington DC, 1978.
3. Spuckler, C. M., Siegel, R., J. Thermophys. Heat Transfer, Vol. 7 (1993), p. 302
4. th IEEE RTP 2003 Conference, Charleston, SC, 2003
5. A. Unterreiter, M. Jung, F. Zingsheim, work in progress