Parasitic-aware RF design via parameterization of embedded passives on multilayer organic substrates

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2007, Pages 107-110

  Min, Sung Hwan ^a   Seo, Chung K ^a   Lapushin, Semyon ^a   Carastro, Larry ^a   Dalmia, Sidharth ^a   White, George ^a   Swaminathan, Madhavan ^b  

^a Jacket Micro Devices Inc   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDPASS FILTERS; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; MULTILAYERS; SUBSTRATES;

DESIGN METHODS; ELECTRICAL CIRCUITS; EMBEDDED INDUCTORS; EMBEDDED PASSIVES; HIGH QUALITIES; ORGANIC SUBSTRATES; PARASITICS; RF DESIGNS;

DESIGN;

EID: 47949086943     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2007.4387136     Document Type: Conference Paper

References (10)

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