Electrochemical co-deposition of sol-gel/metal thin nanocomposite films

Chemistry of Materials

Volumn 20, Issue 13, 2008, Pages 4276-4283

  Toledano, Reut ^a   Shacham, Ronen ^a   Avnir, David ^a   Mandler, Daniel ^a  

^a HEBREW UNIVERSITY OF JERUSALEM   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; CLADDING (COATING); COPPER; COPPER PLATING; ELECTROLYSIS; FILM PREPARATION; GELATION; GELS; IMAGING TECHNIQUES; METAL IONS; METALLIZING; MICROSCOPIC EXAMINATION; MOLECULAR ORBITALS; MOLECULAR SPECTROSCOPY; MONOMERS; NANOCOMPOSITES; NANOSTRUCTURED MATERIALS; PHOTOELECTRON SPECTROSCOPY; SCANNING PROBE MICROSCOPY; SOL-GEL PROCESS; SOL-GELS; SOLS; X RAY PHOTOELECTRON SPECTROSCOPY;

AMERICAN CHEMICAL SOCIETY (ACS); ATOMIC FORCE (AF); CO-DEPOSITION; COPPER DEPOSITION; COPPER(II) IONS; DEPOSITED FILMS; ELECTRODE SURFACES; GRAIN SIZES; HYDROLYSIS AND CONDENSATION; MIXED FILMS; NANO-COMPOSITE COATING; NANO-COMPOSITE FILMS; SINGLE-STEP METHOD; SOL - GEL; SURFACE TECHNIQUES; X RAY PHOTOELECTRON SPECTROSCOPY (XPS);

COLLOIDS;

EID: 47749136247     PISSN: 08974756     EISSN: None     Source Type: Journal    
DOI: 10.1021/cm800002z     Document Type: Article

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