A systematic semi-numerical approach for modeling of signal and power integrity of electronic packages

IEEE International Symposium on Electromagnetic Compatibility

Volumn , Issue , 2007, Pages

  Li, Er Ping ^a   Liu, En Xiao ^a   Oo, Zaw Zaw ^a   Wei, Xingchang ^a   Zhang, Yaojiang ^b   Vahldieck, R ^c  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

^c ETH ZURICH   (Switzerland)

Author keywords

Electronic package; Power integrity; Signal integrity; System level modeling

Indexed keywords

ACCURATE SIMULATION; ELECTRONIC PACKAGE; ELECTRONIC PACKAGING; INTERNATIONAL SYMPOSIUM; MOMENT METHOD; MULTI-LAYERED; NOVEL METHODS; NUMERICAL APPROACHES; POWER INTEGRITY; SCATTERING MATRIX METHOD; SIGNAL INTEGRITY; SYSTEM-LEVEL MODELING;

ELECTRIC INVERTERS; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETISM; METHOD OF MOMENTS; PLASTIC MOLDS; RELIABILITY; TECHNICAL PRESENTATIONS;

NUMERICAL METHODS;

EID: 47749092815     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2007.188     Document Type: Conference Paper

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