Solder reliability solutions: A PC-based design-for-reliability tool

Soldering and Surface Mount Technology

Volumn 9, Issue 2, 1997, Pages 69-93

  Clech, J P ^a  

^a EPSI Inc   (United States)

Author keywords

Design; Reliability; Software; Solder

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SOFTWARE; RELIABILITY; SOLDERING; STRAIN; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING;

AREA-ARRAY PACKAGES; COEFFICIENT OF THERMAL EXPANSION (CTE); SOLDER RELIABILITY SOLUTIONS (SRS); STRAIN ENERGY;

SOLDERED JOINTS;

EID: 4744364699     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (45)

1. Noctor,D., Bader,F.E., Viera,A.P., Boysan,P., Golwalker S., Foehrinqer, R., "'Solder Joint Attachment Reliability Evaluation and Failure Analysis of Thin Small Outline Packages (TSOPs) with Alloy 42 Leads'", IEEE Transactions on CHMT, 16, 8, 961-971, 1993.
2. Darveaux, R., Banerji, K., Mawer, A., Dody, G., "'Reliability of Plastic Ball Grid Array Assemblies'", Chapter 13, "'Ball Grid Array Technology'", J. H. Lau, McGraw-Hill, 379-442. 1995.
3. Mei, Z., "'TSOP Solder Joint Reliability'", Proceedings 46th ECTC, Orlando, FL, 1232-1238, 1996.
4. Zarrow, P., Kopp, D., "'Component Technology: Decisions and Issues'", "Circuit Assembly", 24-25, 1996.
5. Darveaux, R., "'How to Use Finite Element Analysis to Predict Solder Joint Fatigue Life'", Proceedings VIII International Congress on Experimental Mechanics, Nashville, IN, 41-42, 1996.
6. Clech, J.-P., "'Solder Reliability Solutions: from LCCCs to Area Array Assemblies'", Proceedings Nepcon West, 1665-1680. 1996.
7. Clech, J.-P., Manock, J. C., Noctor, D. M., Bader, F. E., Augis, J. A., "'A Comprehensive Surface Mount Reliability Model Covering Several Generations of Packaging and Assembly Technology'", IEEE Transactions on CHMT, 16, 8, 949-960, 1993.
8. Clech, J.-P., "'Strength and Reliability of Flip Chip Assemblies with Underfill'".
9. Clech, J.-P, Noctor, D. M., Manock, J. C., Lynott, G. W., Bader, F. E., "'Surface Mount Failure Statistics and Failure Free Time'", Proceedings 44th ECTC, Washington, DC, 487-497. 1994.
10. Darveaux, R., "'Crack Initiation and Growth in Surface Mount Solder Joints'", Proceedings ISHM Conference, Dallas, TX, 86-97, 1993.
11. Sherry, W. M., Hall, P.M., "'Materials, Structures, and Mechanics of Solder Joints for Surface Mount Microelectronics Technology'", Proceedings Interconnection Technology in Electronics, Fellbach, Germany, 47-61, 1988.
12. Engelmaier, W., "'Surface Mount Attachment Reliability of Clip-leaded Ceramic Chip Carriers on FR-4 Circuit Boards'", IEEE Transactions on CHMT, 12, 2, 284-296, 1989.
13. Hines, L. L., "'SOT-23 Surface Mount Attachment Reliability Studies'", Proceedings IEPS, Boston, MA, 61 3-629, 1987.
14. Lau, J. H., Pao, Y. H., Larmer, C., Govila, R., Twerefour, S., Gilbert, D., Erasmus, S., Dolot, S., "'Reliability of a 0.4 mm Pitch, 256-pin Plastic Quad Flat Pack No-clean and Water-clean Solder Joints'", Soldering & Surface Mount Technology, 16, 42-50, 1994.
15. Lau, J., Golwalker, S., Boysan, P., Surratt, R., Forhinger, R., Erasmus, S., "'Solder Joint Reliability of a Thin Small Outline Package (TSOP)'", Circuit World, 20, 1, 12-19, 1993.
16. Hall, P.M., "'Creep and Stress Relaxation in Solder Joints'", Chapter 10, "'SolderJoint Reliability: Theory and Applications'", J. H. Lau, Van Nostrand Reinhold, 306-332, 1991.
17. Clech, J.-P., Augis, J. A., "'Temperature Cycling, Structural Response and Attachment Reliability of Surface Mounted Leaded Packages'", Proceedings IEPS, Dallas, TX, 305-325, 1988.
18. Kotlowitz, R. W., "'Comparative Compliance of Generic Lead Designs for Surface Mounted Components'", Proceedings IEPS, Boston, MA, 2, 965-984, 1987.
19. Kotlowitz, R. W., "'Compliance Metrics for Surface Mount Component Lead Design'", Proceedings ECTC, Las Vegas, NV, 1054-1063, 1990.
20. Knecht, S., Fox, L., "'Integrated Matrix Creep: Application to Accelerated testing and Lifetime Prediction'", Chapter 16, "'Solder Joint Reliability: Theory and Applications'", J. H. Lau, Van Nostrand Reinhold, 508-544. 1991.
21. Shine, M. C., Fox, L. R., "'Fatigue of Solder Joints in Surface Mount Devices'", Low Cycle Fatigue, ASTM STP 942, 588-610, 1988.
22. Wong, B., Helling, D. E., Clark, R. W., "'A Creep Rupture Model for Two-phase Eutectic Solders'", IEEE CHMT Transactions, II, 3, 284-290, 1988.
23. Stone, D., Hanula, S., Li, C.-Y., "'The Effects of Service and Material Variables on the Fatigue Behaviour of Solder Joints during the Thermal Cycles'", Proceedings Electronic Components Conference, 46-51, 1985.
24. Darveaux, R., Banerji, K., "'Constitutive Relations for Tin-based Solder Joints'", Proceedings 42nd ECTC, San Diego, CA, 538-551, 1992.
25. Hall, P.M., "'Forces, Moments, and Displacements during Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed boards'", IEEE Transactions on CHMT, 7, 4, 314-327, 1984.
26. Jih, E., Pao, Y.-H., "'Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints'", Journal of Electronic Packaging, ASME Transactions, 117, 2, 94-99, 1995.
27. Clech, J.-P., Lanaerman, F. M., Augis, J. A., "'Local GTE Mismatch in SM Leaded Packages: A Potential Reliability Concern'", Proceedings 40th ECTC, Las Vegas, Nevada, 368-376, 1990.
28. Wen, L. C., Mon, G. R., Ross, R. G. Jr., "'Reliability Assessment of Solder Joints on LCCC Packages'", "'Summary of the Phase 1 Round Robin Solder Joint Life Prediction Model Results'", K. Bonner, S. Cornford, Pasadena, CA, 1994.
29. Wen, L. G., Ross, R. G. Jr., "'Comparison of LCC Solder Joint Life Predictions with Experimental Data'", ASME Transactions. Journal of Electronic Packaging, 117, 2, 109-115, 1995.
30. Wen, L. C., Mon. G. R., Ross, R. G. Jr., "'Guidelines for Solder Joint Reliability Determination'", JPL D-13412, Pasadena, CA, 1996.
31. Noctor, D., Clech, J.-P., "'Accelerated Testing and Predictive Modeling of the Attachment Reliability of Alloy 42 and Copper Leaded TSOPs'", Proceedings Nepcon East. Boston, MA, 193-206, 1993.
32. Darveaux, R., Mawer, A., "'Thermal and Power Cycling Limits of Plastic Ball Grid Array (PBGA) Assemblies'", Proceedings Surface Mount International, San Jose, CA, 315-326, 1995.
33. Ejim, T. I., Holliday, A., Bader, F. E., Gahr, S., "'Designed Experiment to Determine Attachment Reliability Drivers for PBGA Packages'", Proceedings Surface Mount International, San Jose, CA, 385-392, 1995.
34. Mawer, A., "'Ball Grid Array Interconnect Technology'", IPC BGA National Symposium, San Diego, 1996.
35. Ejim, T. I., Clech, J. -P., "'Moiré Analysis and Modelling of Area Array Assemblies'", Proceedings VIII International Congress on Experimental and Applied Mechanics, Nashville, TN, 53-54, 1996.
36. Hall, P.M., "'Thermal Expansivity and Thermal Stress in Multilayered Structures'", Chapter 2, 'Thermal Stress and Strain in Microelectronics Packaging'. J. H. Lau, Van Nostrand Reinhold, NY, 78-94, 1993.
37. Ejim, T. I., Clech, J.-P., Dudderar, T. D., Quo, Y., Han, B., "'Measurement of Thermomechanical Deformations of Plastic Ball Grid Array Assemblies using Moiré Interferometry'", Proceedings 1995 SEM (Society for Experimental Mechanics) Conference and Exhibit, Grand Rapids, MI, 121-125, 1995.
38. Gibson, R. F., "'Principles of Composite Material Mechanics'", McGraw-Hill, NY, 1994.
39. Blake, A., "'Practical Stress Analysis in Engineering Design'", Marcel Dekker, NY, 1982.
40. Clech, J.-P., "'Micro-BGA Model'".
41. Fjelstad, J., "Perry, M.", "'FiniteElement Analysis of a Compliant Chip Scale Ball Grid Array Package'", Proceedings CHIPCON, 1996.
42. Suhir, E., "'Thermal Stress Failures in Microelectronic Components - Review and Extension'", 1, Chapter 5, "'Advances in Thermal Modeling of Electronic Components and Systems'", A. Bar-Cohen, A. D. Kraus, Hemisphere Publishing Co., 337-4 12, 1990.
43. Han, B., Guo, Y., Lim, C. K., "'Application of Interferometric Techniques to Verification of Numerical Models for Microelectronics Packaging Design'", "'Advances in Electronic Packaging'", InterPack '95. Maui, Hawaii, 10-2, 1187-1194, 1995.
44. Miner, M. A., "'Cumulative Fatigue Damage'", Journal of Applied Mechanics, A-159-A-184, 1945.
45. Darveaux, R., "'Optimising the Reliability of Thin Small Outline Package (TSOP) Solder Joints'", "'Advances in Electronic Packaging'", InterPack '95. Maui, Hawaii, 10-2, 675-685, 1995.