Degradation and Dielectrics measurements of rotating machines insulation at high temperature (200-400°C)

2007 International Conference on Solid Dielectrics, ICSD

Volumn , Issue , 2007, Pages 130-133

  Aymonino, F ^a   Lebey, T ^a   Malec, D ^a   Petit, C ^b   Saint Michel, J ^b   Anton, A ^b   Gimenez, A ^b  

^a UNIVERSITÉ PAUL SABATIER   (France)

^b Moteurs Leroy Somer   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILMS; COPPER; ELECTRIC CONDUCTIVITY; FOURIER TRANSFORM INFRARED SPECTROSCOPY; INDICATORS (CHEMICAL); INSULATION; IONIZATION OF GASES; IRON; PERMITTIVITY; POLYMERS; ROTATING MACHINERY; ROTATION; STAINLESS STEEL; SULFATE MINERALS;

BREAK DOWN VOLTAGE (BDV); CHEMICAL STRUCTURES; CONDUCTIVE PLATES; ELECTRICAL INSULATION; FREQUENCY RANGING; HIGH TEMPERATURE (HT); INSULATING LAYERS; INTERNATIONAL CONFERENCES; PERMITTIVITY AND LOSS; POLYIMIDE (PI); POWER DENSITY (PD); ROOM-TEMPERATURE (RT); ROTATING MACHINES; SOLID DIELECTRICS; TEMPERATURE RANGES;

THERMAL INSULATION;

EID: 47349099647     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSD.2007.4290770     Document Type: Conference Paper

References (3)

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3. Chai Tai Chong, A. Leslie, Lim Thiam Beng, C. Lee, "Investigation on the effect of copper leadframe oxidation on package delamination", Electronic Components and Technology Conference, Proceedings, 45th, 21-24 May 1995, Page(s):463-469, 1995.