Thermal management in 8-strata 4Gb DRAM SiP

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 310-316

  Matsui, Satoshi ^a   Kurita, Yoichiro ^a   Itou, Makoto ^a   Kawano, Masaya ^a   Mitsuhashi, Toshiro ^b   Ikeda, Hiroaki ^c  

^a RENESAS TECHNOLOGY CORP   (Japan)

^b OKI ELECTRIC INDUSTRY CO   (Japan)

^c Elpida Memory Inc   (Japan)

Author keywords

SMAFTI technology; System in package (SiP); Thermal management; Through silicon via (TSV)

Indexed keywords

CFD SIMULATIONS; COOLING STRUCTURES; MEASUREMENTS OF; SYSTEM-IN-PACKAGE; THERMAL RESISTANCE MEASUREMENT; THERMO-FLUID DYNAMICS; THROUGH-SILICON VIA; VERTICAL INTERCONNECTIONS;

COMPUTATIONAL FLUID DYNAMICS; MICROELECTRONICS; TEMPERATURE CONTROL; THERMODYNAMIC PROPERTIES;

INTERNET PROTOCOLS;

EID: 46649087470     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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