Characterization of surface morphology of copper tungsten thin film by surface fractal geometry and resistivity

Thin Solid Films

Volumn 468, Issue 1-2, 2004, Pages 310-315

  Wang, Y ^a,b   Xu, K W ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b LANZHOU JIAOTONG UNIVERSITY   (China)

Author keywords

Copper tungsten thin films; Fractal dimension; Resistivity; Surface morphology

Indexed keywords

AMORPHOUS FILMS; ATOMIC FORCE MICROSCOPY; ELECTRIC RESISTANCE; FRACTALS; MAGNETRON SPUTTERING; MORPHOLOGY; SILICON WAFERS; TUNGSTEN; X RAY DIFFRACTION ANALYSIS;

COPPER TUNGSTEN THIN FILMS; FRACTAL DIMENSIONS; FRACTAL GEOMETRY; MICRODEVICES;

THIN FILMS;

EID: 4644296078     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.132     Document Type: Article

References (17)

1. Meakin P. Fractal, Scaling and Growth Far From Equilibrium. 1998;404 Cambridge Univ. Press, London.
2. Wang J.-S., Ye G.-X., Xu Y.-Q., Zhang Q. Acta Physica Sinica. 43:1994;1688. (in Chinese).
3. McRae G.A., Maguire M.A., Jeffrey C.A., Guzonas D.A., Brown C.A. Applied Surface Science. 191:2002;94.
4. Jong C.-A., Chin T.-S. Materials Chemistry and Physics. 74:2002;201.
5. Ming Q., Zai P., Klaus F. Tribology International. 30:1997;87.
6. Luth H. Solid Surfaces, Interfaces and Thin Films. 2001;Springer, New York.
7. Mandelbrot B.B. The Fractal Geometry of Nature. 1982;Freemen Press, San Francisco.
8. Russ J. Fractal Surfaces. 1994;77 Plenum Press, New York and London.
9. Li J.M., Lu L., Su Y., Lai M.O. Applied Surface Science. 161:2000;187.
10. Grzeta B., Radic N. Journal of Non-Crystalline Solids. 170:1994;101.
11. Day M.E., Delfino M., Fair J.A., Tsai W. Thin Solid Films. 254:1995;285.
12. Tayfun B., Kayhan D. Fractal. 9:2001;105.
13. Barmak K., Lucadamo G.A., Cabral C. Journal of Applied Physics. 87:2000;2204.
14. Eklund E.A., Bruninsma R., Rudnick J. Physical Review Letters. 67:1991;1759.
15. Liu Z.-J., Jiang N. Journal of Applied Physics. 92:2002;3559.
16. Castleman K.R. Digital Image Processing. 1996;207 Prentice Hall, New Jersey.
17. Tang W., Xu K.-W., Wang P., Li X. Acta Metallurgica Sinica. 38:2002;449. (in Chinese).