Improvement of adhesion strength of W-B-N glue layer on Si for magnetic devices

Physica Status Solidi (B) Basic Research

Volumn 241, Issue 7, 2004, Pages 1645-1649

  Lee, Chang Woo ^a   Kim, Ji Gon ^a  

^a Kookmin University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 4644291998     PISSN: 03701972     EISSN: None     Source Type: Journal    
DOI: 10.1002/pssb.200304657     Document Type: Conference Paper

References (8)

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5. Y. T. Kim, D. J. Kim, C. W. Lee, and J.-W. Park, SPIE 3214, 48 (1997).
6. J. Valli, U. Makela, and H. T. G. Hentzell, J. Vac. Sci. Technol. A 4, 2854 (1986).
7. C. W. Lee, Y. T. Kim, and S.-K. Min, Appl. Phys. Lett. 62(25), 3312 (1993).
8. C. W. Lee, Y. T. Kim, H. S. Lee, Y. K. Park, T.-H. Lee, Q. Chen, and N. V. Richardson, J. Kor. Phys. Soc. 39(6), 1019 (2001).