Noise coupling to signal trace and via from power/ground simultaneous switching noise in high speed double data rates memory module

IEEE International Symposium on Electromagnetic Compatibility

Volumn 2, Issue , 2004, Pages 592-597

  Park, Jongbae ^a   Kim, Hyungsoo ^a   Pak, Jun So ^a   Jeong, Youchul ^a   Baek, Seungyong ^a   Kim, Joungho ^a   Lee, Jung Joon ^b   Lee, Jae Joon ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Line Length; Line Position; Power Ground SSN; Reference changing Via; SSN Coupling effect

Indexed keywords

LINE LENGTH; LINE POSITIONS; POWER/GROUND SSN; REFRENCE CHANGING VIA; SSN COUPLING EFFECT;

ELECTRIC IMPEDANCE; ELECTRIC LINES; ELECTRIC POTENTIAL; MICROPROCESSOR CHIPS; MICROSTRIP DEVICES; MULTILAYERS; PROBLEM SOLVING; SPURIOUS SIGNAL NOISE;

SIGNAL PROCESSING;

EID: 4644269666     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. th Electronics Packaging Technology Conference, Singapore, 2003
2. Jun So Pak, et al, 'Coupling of Through-Hole Signal Via to P/G Resonance and excitation of edge radiation in Multi-layer PCB', Electromagnetic Compatibility, 2003 IEEE International Symposium on, Aug. 2003
3. Junho Lee, et al, 'Effect of Decoupling Capacitor on Signal Integrity in Applications with Reference Plane Change', Electronic Components and Technology Conference, 2003
4. Takashi Harada, et al, 'Radiated Emission from a Multilayer PCB with Traces Placed between Power/Ground Planes', Electromagnetic Compatibility, 2002 IEEE International Symposium on, Aug. 2002