Radiated emission from a multilayer PCB with traces placed between power/ground planes

IEEE International Symposium on Electromagnetic Compatibility

Volumn 1, Issue , 2002, Pages 253-257

  Harada, Takashi ^a   Sasaki, Hideki ^a   Kuriyama, Toshihide ^a  

^a NEC CORPORATION   (Japan)

Author keywords

Internal Trace; Multilayer PCB; Power Distribution Planes; Radiated Emission

Indexed keywords

CAPACITORS; ELECTRIC POTENTIAL; ELECTRIC POWER DISTRIBUTION; NATURAL FREQUENCIES; RADIATION;

DECOUPLING CAPACITORS; RADIATED EMISSIONS;

PRINTED CIRCUIT BOARDS;

EID: 0036382043     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. M. Tanaka, et al., "EMI Resulting from High-Speed Routing between Power and Ground Planes" Technical Report of IEICE EMCJ99-26, Jul. 1999.
2. T. Harada, et. al., "Investigation on Radiated Emission Characteristics of Multilayer Printed Circuit Boards," IEICE Trans. Commun. E80-B, No 11, pp.1645-1651, Nov. 1997.
3. T. Harada, et. al., "Power-Distribution-Plane Analysis for Multilayer Printed Circuit Boards with SPICE," Proceedings of 2000 IEMT/IMC Symposium, pp.420-425, Apr. 2000.