One-step wet chemical method to Cu(OH) 2 nanowires

Journal of Nanoscience and Nanotechnology

Volumn 7, Issue 12, 2007, Pages 4562-4566

  Sun, Jinhe ^a,b   Jia, Yongzhong ^a,c   Jing, Yan ^a   Yao, Ying ^a   Li, Wu ^a  

^a QINGHAI INSTITUTE OF SALT LAKES   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^c TAIZHOU UNIVERSITY   (China)

Author keywords

Cu(OH) 2 4; pH Value; Reconstruction; Synthesis

Indexed keywords

CONTROLLED TEMPERATURE; WET-CHEMICAL METHODS;

COPPER;

COPPER ALLOYS;

EID: 46349102242     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2007.897     Document Type: Article

References (37)

1. F. Favier, E. C. Walter, M. P. Zach, T. Benter, and R. M. Penner, Science 293, 2227 (2001).
2. (a) J. Q. Hu, B. Deng, W. X. Zhang, K. B. Tang, and Y. T. Qian, Inorg. Chem. 40, 3130 (2001);
3. (b) Y. Ding, G. T. Zhang, H. Wu, B. Hai, L. B. Wang, and Y. T. Qian, Chem. Mater. 13, 435 (2001).
4. (a) C. R. Martin, Science 266, 1961 (1994);
5. (b) B. R. Martin, D. J. Dermody, B. D. Reiss, M. Fang, L. A. Lyon, M. J. Natan, and T. E. Mallouk, Adv. Mater. 11, 1021 (1999);
6. (c) M. H. Huang, A. Choudrey, and P. Yang, Chem. Commun. 1063 (2000).
7. (a) X. F. Duan and C. M. Lieber, Adv. Mater. 12, 298 (2000);
8. (b) J. T. Hu, T. W. Odom, and C. M. Lieber, Acc. Chem. Res. 32. 435 (1999);
9. (c) Z. W. Pan, Z. R. Dai, C. Ma, and Z. L. Wang, J. Am. Chem. Soc. 124, 1817 (2002);
10. (d) M. H. Huang, Y. Y. Wu, H. Feick, N. Tran, E. Weber, and P. D. Yang, Adv. Mater. 13, 113 (2001);
11. (e) C. H. Liang, G. W. Meng, Y. Lei, F. Phillipp, and L. D. Zhang, Adv. Mater. 13, 1330 (2001);
12. (f) Y. Y. Wu and P. D. Yang, Chem. Mater. 12, 605 (2000).
13. (a) T. J. Trentler, K. M. Hickman, S. C. Goel, A. M. Viano, P. C. Gibbons, and W. E. Buhro, Science 270, 1791 (1995);
14. (b) Y. G. Sun and Y. N. Xia, Adv. Mater. 14, 833 (2002);
15. (c) Y. G. Sun, B. Gates, B. Mayers, and Y. N. Xia, Nano. Lett. 2, 165 (2002);
16. (d) B. Gates, Y. D. Yin, and Y. N. Xia, J. Am. Chem. Soc. 122, 12582 (2000).
17. (a) W. Fujita and K. Awaga, Synth. Met. 122, 569 (2001);
18. (b) W. Fujita and K. Awaga, J. Am. Chem. Soc. 119, 4563 (1997);
19. (c) W. Fujita and K. Awaga, Inorg. Chem. 35, 1915 (1996).
20. X. G. Wen, Y. T. Xie, C. L. Choi, K. C. Wan, X.-Y. Li, and S. H. Yang, Langmuir 21, 4729 (2005).
21. Z. L. Wang, X. Y. Kong, X. G. Wen, and S. H. Yang, J. Phys. Chem. B 107, 8275 (2003).
22. W. Z. Wang, O. K. Varghese, C. M. Ruan, M. Paulose, and C. A. Grimes, J. Mater. Res. 18, 2576 (2003).
23. (a) P. McFadyen and E. Matijevic, J. Colloid Interface Sci. 44, 95 (1973);
24. (b) S.-H. Lee, Y. S. Her, and E. Matijevic, J. Colloid Interface Sci. 186, 193 (1997).
25. X. G. Wen, W. X. Zhang, S. H. Yang, Z. R. Dai, and Z. L. Wang, Nano Lett. 12, 1397 (2002).
26. X. G. Wen, W. X. Zhang, and S. H. Yang, Langmuir 19, 5898 (2003).
27. W. Z. Wang, C. Lan, Y. Z. Li, K. Q. Hong, and G. H. Wang, Chem. Phys. Lett. 366, 220 (2002).
28. C. H. Lu, L. M. Qi, J. H. Yang, D. Y. Zhang, N. Z. Wu, and J. M. Ma, J. Phys. Chem. B 108, 17825 (2004).
29. G. H. Du and G. V. Tendeloo, Chem. Phys. Lett. 393, 64 (2004).
30. X. Y. Song, S. X. Sun, W. M. Zhang, H. Y. Yu, and W. L. Fan, J. Phys. Chem. B 108, 5200 (2004).
31. S. H. Park and H. J. Kim, J. Am. Chem. Soc. 126, 14368 (2004).
32. X. F. Wu, H. Bai, J. X. Zhang, F. E. Chen, and G. Q. Shi, J. Phys. Chem. B 109, 22836 (2005).
33. (a) W. X. Zhang, X. G. Wen, and S. H. Yang, Inorg. Chem. 42, 5005 (2003);
34. (b) W. X. Zhang, X. G. Wen, and S. H. Yang, Adv. Mater. 15, 822 (2003).
35. Y.-H. Luo, J. Huang, J. Jin, X. Peng, W. Schimitt, and I. Ichinose, Chem. Mater. 18, 1795 (2006).
36. Y. Cudennec and A. Lecerf, Solid Slate Sci. 5, 1471 (2003).
37. P. Umek, A. Zorko, P. Cevc, M. Skarabot, Z. Jaglicic, J. W. Seo, L. Forro, H. V. Tool, L. C. Brunei, and D. Arcon, Nanotechnology 16, 1623 (2005).