Measurement method of bond Strength for silicon direct wafer bonding

Proceedings of IEEE ICIA 2006 - 2006 IEEE International Conference on Information Acquisition

Volumn , Issue , 2006, Pages 1021-1025

  Liguo, Chen ^a   Tao, Chen ^a   Lining, Sun ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Bonding strength; Crack opening; Surface energy; Wafer bonding

Indexed keywords

COMPUTER GRAPHICS; FRACTURE FIXATION; FRACTURE TOUGHNESS; IMAGE PROCESSING; IMAGING SYSTEMS; MEASUREMENTS; MERGERS AND ACQUISITIONS; OPTICAL DATA PROCESSING; WAFER BONDING;

(100) SILICON; (E ,2E) THEORY; BOND ENERGIES; BOND STRENGTHS; CRACK OPENINGS; DIRECT WAFER BONDING; INFORMATION ACQUISITIONS; INTERNATIONAL CONFERENCES; IR VISION; MEASUREMENT METHODS; MEASUREMENT SYSTEMS; SILICON-DIRECT-BONDING (SDB);

SILICON WAFERS;

EID: 46249131515     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICIA.2006.305878     Document Type: Conference Paper

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