Characterization of silicon wafer bonding by observation in transmitted infrared radiation from an extended source

Thin Solid Films

Volumn 364, Issue 1, 2000, Pages 274-279

  Piotrowski, T ^a   Jung, W ^a  

^a ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CAMERAS; SILICON ON INSULATOR TECHNOLOGY; THERMOGRAPHY (IMAGING);

BONDING QUALITY;

SILICON WAFERS;

EID: 0033894055     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(99)00901-3     Document Type: Article

References (5)

1. Lasky J.B., Stiffler S.R., White F.R., Abernathey J.R. Tech. Digest IEDM. 85:1985;684.
2. Born M., Wolf E. Principles of Optics. 1969;Pergamon Press, Oxford.
3. Wolf H.F. Silicon Semiconductor Data. 1969;Pergamon Press, Oxford.
4. J. Lozinko, A. Panas, T. Piotrowski, I. Rangelow, P. Grabiec, ELTE 97, Krynica 6-9 Maj, 1997.
5. Maszara W.P., Goetz G., Caviglia A., McKitterik J.B. J. Appl. Phys. 64:1988;4943.