The role of Harper-Dorn creep at high temperatures and very low stresses

Journal of Materials Science

Volumn 43, Issue 14, 2008, Pages 4801-4810

  Kumar, Praveen ^a,c   Kassner, Michael E ^a   Langdon, Terence G ^a,b  

^a UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

^b UNIVERSITY OF SOUTHAMPTON   (United Kingdom)

^c Naval Postgraduate School ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; APPROXIMATION THEORY; CREEP; CRYSTALLOGRAPHY; DISLOCATIONS (CRYSTALS); LAWS AND LEGISLATION; LIGHT METALS; MICROFLUIDICS; NUMERICAL ANALYSIS; SINGLE CRYSTALS; SOLIDS;

(8 HYDROXY QUINOLINE) ALUMINUM; (ABIOTIC AND BIOTIC) STRESS; (I ,J) CONDITIONS; (P ,P ,T) MEASUREMENTS; BUSINESS MEDIA; CONVENTIONAL POWER; DISLOCATION DENSITIES; EXPERIMENTAL RESULTS; FLOW PROCESSING; HARPER-DORN (HD) CREEP; HIGH TEMPERATURE (HT); HIGH-PURITY; HOMOLOGOUS TEMPERATURES; LOW STRESS REGION; REACTIVITY (CHEMICAL); REASONABLE AGREEMENT; SPECIAL SECTIONS; SPRINGER (CO); STRESS EXPONENTS; THRESHOLD STRESSES;

STRESSES;

EID: 45849135235     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-008-2680-4     Document Type: Article

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