Tensile creep behaviour of coarse grained copper foils at high homologous temperatures and low stresses

Materials Science and Technology

Volumn 21, Issue 6, 2005, Pages 701-707

  Srivastava, V ^a   McNee, K R ^a   Jones, H ^a   Greenwood, G W ^a  

^a UNIVERSITY OF SHEFFIELD   (United Kingdom)

Author keywords

Copper foils; Creep behaviour

Indexed keywords

CAVITATION; COPPER; CREEP; GRAIN BOUNDARIES; HIGH TEMPERATURE EFFECTS; MICROSTRUCTURE; STRESSES; SURFACE PROPERTIES; TENSILE PROPERTIES; TENSILE TESTING;

COPPER FOILS; CREEP BEHAVIOR; GRAIN BOUNDARY MOVEMENTS; HARPER-DORN (HD) CREEP;

METAL FOIL;

EID: 21944441685     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/174328405X46105     Document Type: Article

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