Selective formation of micropads for 3D interconnect applications

ECS Transactions

Volumn 11, Issue 6, 2007, Pages 305-312

  Mathew, V ^a   Chatterjee, R ^a   Garcia, S ^a   Acosta, E ^a   Jones, R ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; COPPER COMPOUNDS; COPPER PLATING; DIFFUSION BARRIERS; ELECTROLESS PLATING; WAFER BONDING;

3D INTERCONNECT; CHIP STACKING; IMMERSION PLATING; KEY PROCESS; PLATING CONDITIONS; PLATING RATES; SELECTIVE FORMATION; THERMO COMPRESSION BONDING;

TIN COMPOUNDS;

EID: 45749101664     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2778388     Document Type: Conference Paper

References (11)

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